SMARC
SMARC steht für Smart Mobility Architecture und ist eine Spezifikation der Standardization Group for Embedded Technologies e.V. (SGET) für Computer-on-Module (COM). Zielmarkt sind kompakte Low-Power Systeme auf Basis von ARM- und X86-Technologie.
- Zwei Formfaktoren
- Full Size Module: 82 x 80 mm
- Short Module 82 x 50 mm
- Bietet dank 314 Pins (MXM-3 Connector) Platz für eine Vielzahl von Schnittstellen
- Gut geeignet für mobile, vernetzte Embedded-Lösungen.
- Elaubt 4 x Gigabit Ethernet und 4 x MIPI CSI – jeweils doppelt so viel wie SMARC 2.0.
- Für den Einsatz unter rauen, industriellen Umgebungsbedingungen entwickelt.
- SMARC-Module eignen sich auch als skalierbare AIoM-Lösungen (AI on Module) und sind damit eine gute Alternative für den wachsenden Bedarf an künstlicher Intelligenz in IoT-Szenarien.
- Intel® Core-i®/Pentium®/Celeron® and Atom® x7000 Series
- SMARC2.1.1 pinout
- Intel® Core-i®/Pentium®/Celeron® and Atom® x7000 Series Processors
- Single-CH LPDDR5 4800MT/s up to 16GB, support IBECC
- Triple displays up to 4K2K (DP++, HDMI, LVDS/eDP/MIPI-DSI)
- Multiple I/O expansion: PCIe gen3, USB3.2 Gen2, SATA, CAN-bus
- On board eMMC up to 64GB (Optional)
- Supports iManager, Embedded Software APIs and Wise-DeviceOn
- SMARC 2.0 module based on Intel® Atom™ E3900, Pentium® and Celeron® processor series
- Up to 8 GByte DDR3L memory down (ECC / non ECC) / Up to 8GByte LPDDR4
- Triple display support
2x USB 3.0, 4x USB - 2.0 (alternativelyl 1x USB OTG), 1x SATA, eMMC onboard
- Industrial grade temperature
- Support of Kontron’s Embedded Security Solution (Approtect) as option
- Up to 16 GByte LPDDR4 memory down with inband ECC support
- 2x USB 3.0, 4x USB 2.0, 1x SATA, eMMC onboard, up to 2x LAN onmodule +
- 1 optional via SERDES
- TSN support
- Industrial grade temperature
- SMARC Module with NXP LS1028 Layerscape Processor
- Dual-Core Cortex A-72 on a SMARC short size form factor
- Up to 8 GByte DDR3L non-ECC and ECC memory down. ECC as default.
- One PCIe line can be used as QSGMII port to drive 4 1 GByte TSN capable Ethernet ports
- 3D GPU
- 2x Gigabit Ethernet, TSN capable
- Ultra-low power ARM and SoC-based SMARC Module based on NXP i.MX6 family Solo – Dual – Quad Core.
- Based on NXP i.MX 6 Family
- SoC scalable from Solo Core, Dual Core up to Quad Core
- ARM specific featureset incl. PCIe and graphic
- SMARC Module with extremely low power NXP i.MX7 series processor, Solo / Dual Core
- Up to 2x 1 GHz Cortex® A7 + 200 MHz M4 processor
- Up to 2 GByte RAM
- Dual channel LVDS interface
- Up to 2x GByte Ethernet, 3x PCIe, 4x USB 2.0
- Rockchip high performance full size SMARC module
- Based on RK3399(K) from Rockchip
- Up to 8 GByte LPDDR4 memory down
- 3D Graphics Engine: Arm® Mali-T860MP4
- Extended commercial temperature range
- 2x Gigabit Ethernet
- Intel® Pentium®/Celeron® N4200 Series and Atom® x6000 Series
- Supports iManager, WISE-PaaS/RMM and Embedded Software APIs
- Triple Display (DP++, HDMI, LVDS)
- Dual Channel up to 16GB LPDDR4 3200MT/s and IBECC supported by specific SKUs
- Onboard storage UFS up to 256GB
- Dual LAN with TSN Support
- SMARC2.0 & SMARC2.1 Compliance
- Intel® Pentium®/Celeron® N4200 Series and Atom Series SMARC Module
- Supports iManager, WISE-PaaS/RMM and Embedded Software APIs
- Triple Display (DP++, HDMI, LVDS)
- Dual channel LPDDR4 2/4/8 GB memory down & onboard eMMC
- Integrated dual GbE. Wireless module on Board Design
- SMARC® Rel. 2.1.1 compliant module with the Intel® Atom® x6000E Series and Intel® Pentium® and Celeron® N and J Series processors (formerly Elkhart Lake) for FuSa applications
- Integrated Gen11 UHD Graphics controller supporting 3 independent displays
- 2x GbE with precision time protocol IEEE 1588, optional SERDES for external 3rd Ethernet, 6x USB 2.0, 3x USB 3.1, up to 4x PCI-e
- Quad Channel LPDDR4x Soldered Down with IBECC
- SMARC® Rel. 2.0 compliant module with the Intel® Atom™ X Series, Intel® Celeron® J / N Series and Intel® Pentium® N Series (formerly Apollo Lake) Processors
- 2x GbE; 6 x USB 2.0; 2 x USB 3.0; 4x PCI-e
- Integrated Gen9-LP HD Graphics controller
- Dual Channel Soldered Down LPDDR4-2400 memory
- SMARC Rel. 2.0 compliant module with NXP i.MX 8M Applications Processors
- WiFi + BT LE; CSI camera; QuadSPI interface; 12x GPI/Os
- Integrated Graphics Processing Unit, supports 2 independent displays
- Up to 4GB soldered down LPDDR4-3200 memory, 32-bit interface
- NXP i.MX 8M Mini with Dual/Quad Arm Cortex-A53
- SMARC revision 2.1 compliant
- LVDS, DSI graphic output interfaces
- CAN bus / USB 2.0 interfaces
- Dual GbE ports
- I²S audio codec interface
- Rugged operating temperature (optional): -40°C to 85°C
- 10 year product availability
- Dual or quad-core Intel Atom® E3900 Series or Pentium™ N4200 or Celeron™ N3350 Processor SoC
- Up to 8 GB DDR3L at 1867 MHz
- Triple display support
- HEVC H.265, Dual channel LVDS, HDMI/DP++, DP++, and 2x MIPI CSI camera (2/4 lanes)
- 1x GbE with IEEE1588 (PTP) supported
- 1x SATA 3.0, onboard eMMC
- 4x PCIe x1
- Windows 10 IoT Enterprise/Core and Yocto Linux supported
- Up to 4GB soldered down LPDDR4-3200 memory, 32-bit interface
- SMARC Short Size Module with Intel® 6th Gen. Atom® x6000 Processors (formerly codename: Elkhart Lake)
- SMARC revision 2.1.1 compliant
- Up to 8GB LPDDR4, in-band ECC
- Dual 2.5GbE
- PCIe Gen3 lanes, USB 3.2 10Gbps
- Real-time I/O (GPIO, UART, I2C)
- Rugged operating temperature (optional): -40°C to +85°C
- 10 year product availability
- NXP i.MX 8M Plus with Quad Cortex-A53
- Optional in-SoC 2.3 TOPS NPU / Wi-Fi / BT
- SMARC revision 2.1 compliant
- LVDS, DSI, HDMI graphic output interfaces
- Dual CAN bus / USB 2.0 / USB 3.0 interfaces
- Dual GbE ports (one TSN capable)
- I2S audio codec interface
- Rugged operating temperature (optional): -40°C to +85°C
Beratung & Support
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