COMe

COM Express® has been the industry standard for more than 15 years. With 3 different form factors (mini, compact, basic), suitable performance classes are available for every application.

  • Proven industry standard for x86 processors
  • Three current pinout types
    1. COM Express Type 6
    2. COM Express Type 7
    3. COM Express Type 10
  • Three form factors
    1. Basic (125 x 95 mm) for mobile CPUs (Intel® Core™ or AMD-Ryzen-CPUs)
    2. Compact (95 x 95 mm) for more powerful but power-saving platforms (E.g. CPUs of the Intel U-series or AMD Ryzen)
    3. Mini (55 x 84 mm) for mobile application in the lower performance range (Intel® Atom™) with little space
  • Intel® Core™ i3, N series and Atom® x7000 Series Processors (Alder Lake-N/Amston Lake) COM Express® Compact Type 6 Module
  • COM Express® R3.1 Compact Module Type 6 Pinout
  • Intel® Core™ i3, N series and Atom® x7000 Series Processors
  • Single-CH DDR5 4800MT/s up to 16GB, support IBECC
  • PCIe gen3, USB3.2 Gen2, SATA3.0, 2.5GbE support TSN
  • On board eMMC (Option)
  • Supports iManager, Embedded Software APIs and Wise-DeviceOn
  • Intel® 14th Gen Core Processors (Code Name: Meteor Lake-U/H) COM Express Basic Type6 Module
  • COM Express® R3.1 Basic Module Type 6 Pinout
  • Intel® 14th Gen Core Processors , Up to 14C/20T
  • Intel Xe LPG graphic up to 128EU, 4 independent 4K display
  • Dual-CH DDR5 5600MT/s up to 96GB SOMDIMM
  • Multiple I/O expansion: 2.5GbE, PCIe gen4, USB4 & USB3.2 Gen2, SATA3.0
  • Support Dual BIOS failsafe
  • Supports iManager, Embedded Software APIs and Wise-DeviceOn
  • 13th Generation Intel® Core™ Processor
  • COM Express R3.1 Compact Module Type 6 Pinout
  • Dual channel memory up to 64GB, 4800MT/s
  • High speed I/O: 16x PCIe Gen4, 8x PCIe Gen3, 2x USB4 & 4x USB3.2 Gen2
  • Supports SUSI, DeviceOn and Edge AI Suite
  • COM Express® Basic Type 6 with Intel® Core™ Ultra Meteor  Lake-H/U series
  • Intel® Arc™ Graphics architecture with up to 8 Xᵉ-Cores (128EUs)
  • Integrated NPU for dedicated AI acceleration
  • Up to 96 GByte DDR5 memory
  • Up to 2.5 Gb Ethernet
  • Optional NVMe SSDs onboard
Kontron COMe-bRP6 (E2)
  • COM Express® Basic Type 6 mit 13th Generation Intel® Core™ Processors
  • Up to 64 GByte DDR5 memory
  • Up to 2.5 Gb Ethernet with TSN support
  • Optional NVMe SSD onboard
  • Industrial grade versions
  • COM Express Rev. 3.1 Basic Size Type 6 Module with 13th Gen Intel® Core™ Mobile Processor
  • Additional Real time / Industrial SKUs (14C/20T)
  • Up to 64GB DDR5 SO-DIMM at 4800 MT/s, IBECC
  • AI inferencing (AVX-512 VNNI, Intel® Iris® Xe)
  • PCIe Gen4, 4x displays / 2x USB4
  • Extreme rugged operating temperature (option)
  • COM Express® 3.1 Type 6 Basic Module with 13th Gen Intel® Processors (Raptor Lake-P)
  • Embedded Intel® Iris® Xe graphics with up to 96 execution units
  • 1x NBase-T 2.5GbE; 2x USB4.0 Gen2; 4x USB3.2 Gen 2; 8x USB 2.0; 8x PCI-e x1 Gen3; PEG x8 Gen4 and 2x PEG x4 Gen4
  • Two DDR5 SO-DIMM Slots supporting DDR5-4800 IBECC Memory, up to 64GB
COMe-bTL6 (E2) Kontron
  • COM Express® Basic Type 6 with 11th Generation Intel® Core™ / Xeon® Processors
  • Up to 128 GByte DDR4 memory
  • Up to 2.5 Gb Ethernet with TSN support
  • Optional NVMe SSD onboard
  • Industrial grade versions
Kontron come bcl6
  • Intel® 8th/9th Generation Core™ series / Xeon® E family with CM246/QM370 PCH
  • Up to 128 GByte DDR4 non-ECC/ECC memory
  • Optional NVMe SSD onboard
  • Industrial grade versions
  • Support of Kontron’s Embedded Security Solution (APPROTECT)
Kontron come bDV7
  • COM Express® basic Type 7 with Intel® Atom® processor C3000 product family
  • Entry level server-grade platform
  • Quad 10 GbE interfaces
  • High-speed connectivity PCIe 3.0, SATA3, USB 3.0
  • Up to 128GB DDR4 memory
  • Industrial grade versions
kontron COMe-bID7
  • COM Express® basic Type 7 with Intel® Xeon® D-1700 processor family
  • Server-grade platform
  • Quad 10 GbE interfaces
  • High-speed connectivity 16x PCIe 4.0 + 16x PCIe 3.0, SATA, USB 3.0
  • Up to 1 TByte NVMe SSD onboard
  • Industrial grade versions
     
Kontron come bBD7
  • COM Express® basic Type 7 with Intel® Xeon® and Pentium® processor D-1500 SoC
  • Dual 10 GbE interfaces
  • High-speed connectivity x24 PCIe 3.0 + x8 PCIe 2.0, SATA3, USB 3.0
  • Industrial grade versions
Kontron COMe-bV26
  • COM EXPRESS® Basic V2000 with AMD Embedded V-series High-Performance “ZEN2” CPU 
  • Up to 64 GByte DDR4 memory (2x 32 GByte dual-channel DDR4 SO-DIMM)
  • Up to 8 PCIe lanes (4x PCIe 3.0 (up to 8 GT/s) 4x PCIe 2.0 (up to 5 GT/s))
  • Optional up to 1 TByte NVMe SSD onboard
  • Industrial grade versions available
kontron COMe-bEP7
  • COM EXPRESS® Basic Type 7  with AMD Epyc Embedded 3000 SoC Processsors
  • Supports Single-Die SP4r2 (up to 8 cores) and Dual-Die SP4 (up to 16 core) processors
  • Quad 10GbE interfaces
  • 4 x SODIMM sockets (up to 128GB DDR4 memory) on request
  • Industrial grade versions
  • COM Express Type 7 Basic Size Module with Intel® Xeon® D-1700 Processor (formerly codename: Ice Lake-D)
  • Up to 10 cores, 15MB cache
  • Edge AI (Intel® AVX-512 & VNNI)
  • 4x 10G Ethernet
  • 16 PCIe Gen4, 16 PCIe Gen3 lanes
  • Industrial-grade reliability
  • COM Express Rev. 3.1 Basic Size Type 6 Module with 12th Gen Intel® Core™ Processor
  • Up to 14 cores, 20 threads
  • Edge AI (VNNI, Intel® Iris® Xe)
  • DDR5 up to 4800 MT/s
  • 16 PCIe Gen4 lanes
  • USB4/TBT
  • COM Express Basic Size Type 6 Module with 11th Gen Intel® Core™, Intel® Xeon® and Intel® Celeron® Processors
  • Intel® Tiger Lake-H Processors (up to 8 cores) integrated with Intel® UHD Graphics (Xe architecture)
  • AI inference (AVX512 VNNI + Intel® UHD GFX)
  • Up to 128GB DDR4 SO-DIMM, non-ECC, ECC
  • 3x DDI channels, 1x LVDS (opt. 4 lane eDP), opt. VGA, up to 4 independent displays
  • PCIe x16 Gen4, 2.5GbE (TSN, build option)
  • Extreme Rugged operating temperature: -40°C to +85°C (build option, selected SKUs
  • COM Express® Compact Type 6 with  Intel® Atom® X7000E/X7000RE 
  • Low-Power – Performance/Watt optimized form factor solution
  • Up to 16 GByte DDR5 4800 MT/s – In-Band ECC
  • Up to 4x Graphics interfaces
  • Up to 6x PCIe lanes, up to 4x USB 3.2/2.0, 6x USB 2.0
  • Up to 2.5 Gb Ethernet with TSN support
  • Industrial grade temperature
  • COM Express® Compact Type 6 with 13th Generation Intel® Core™ Processors
  • Up to 64 GByte LPDDR5 memory down
  • Up to 2.5 Gb Ethernet with TSN support
  • Optional NVMe SSD onboard
  • Industrial grade versions
kontron COMe-cAP6
  • COM Express® Compact Type 6 with 12th Generation Intel® Core™ Processors
  • Up to 64 GByte LPDDR5 memory
  • Up to 2.5Gb Ethernet with TSN and WOL support
  • Quad Independent Display Support (up to 8k)
  • Optional NVMe SSD onboard
Kontron COMe-ctl6
  • COM Express® Compact Type 6 with 11th Generation Intel® Core™ Processors
  • Up to 48 GByte DDR4 memory (16 GByte DDR4 memory down)
  • Up to 2.5 Gb Ethernet with TSN support
  • Optional NVMe SSD onboard
  • Industrial grade versions
kontron computer-on-modules COMe_cdv7
  • COM Express® compact Type 7 with Intel® Atom® processor C3000 product family
  • Entry level space-optimized server-grade platform
  • Quad 10 GbE interfaces
  • High-speed connectivity PCIe 3.0, SATA3, USB 3.0
  • Up to 64GB DDR4 memory
  • Industrial grade versions
  • Support of Kontron’s Embedded Security Solution – APPROTECT
Kontron COMe-cEL6
  • COM Express® compact Type 6 with Intel Atom® x6000E, Pentium® and Celeron® Series
  • Low-power – performance/watt optimized form factor solution
  • Up to 32 GByte DDR4-3200 Memory via 2x SODIMM sockets (In-Band ECC)
  • Triple display support
  • 6x PCIe 3.0 lanes
  • Up to 4x USB 3.1/2.0, 4x USB 2.0, 2x SATA, eMMC Flash
  • TSN Support
  • Industrial grade temperature
kontron come-cal6
  • COM Express® compact Type 6 with Intel® Atom™ E3900 Series, Pentium® and Celeron® Processors
  • Low-power – performance/watt optimized form factor solution
  • Up to 8 GByte DDR3L 1600 / 1867 Memory (2x SODIMM socket)
  • Triple display support
  • Up to 5x PCIe lanes
  • 4x USB 3.0/2.0, 4x USB 2.0, 2x SATA, eMMC Flash
  • Industrial grade temperature
Kontron COMe-cVR6
  • COM EXPRESS® Compact Type 6 with AMD Ryzen™ Embedded V/R1000 Series APUs
  • Leading graphics performance
  • Up to 4 independent display support
  • Up to 48 GByte DDR4 memory (16 GByte DDR4 memory down)
  • Industrial grade versions
  • Support of Kontron’s Embedded Security Solution (Approtect)
  • COM Express Compact Size Type 6 Module with 11th Gen Intel® Core™ and Celeron® Processors
  • PCIe Gen4 and PCIe Gen3 lanes
  • AI inference (VNNI + Iris Xe graphics)
  • 2.5GbE Ethernet, with optional TSN
  • In-Band ECC error correction
  • COM Express Compact Size Type 6 Module with Intel Atom® x6000E Processor SoC (formerly codename: Elkhart Lake)
  • In-Band ECC error correction
  • 2.5GbE Ethernet, with optional TSN
  • PCIe Gen3 lanes, USB 3.2 10Gbps
  • 3x 4K display
  • Real Time I/O (GPIO, UART, I2C)
  • COM Express Compact Size Type 6 Module with AMD Ryzen™ Embedded V2000 APU (Zen 2 architecture)
  • Up to 8 cores based on AMD Zen 2 architecture
  • Improved graphics performance (new Radeon Vega GPU)
  • Up to 4x 4K displays (DP, eDP)
  • 2.5GbE Ethernet, up to 16 PCIe Gen3 lanes
  • Configurable TDP down to 10W (8, 6 cores)
  • COM Express® Compact Size Type 2 Module with Intel Atom® E3800 Series or Intel® Celeron® Processor SoC (formerly codename: Bay Trail)
  • VGA and dual channel 18/24-bit LVDS
  • Up to 8GB Dual Channel DDR3L at 1333MHz
  • Single, dual, Quad-core Intel Atom® E3800 Series or Celeron® Processor SoC
  • Two PCIe x1, and 32-bit PCI bus
  • GbE, one SATA 3Gb/s, one PATA IDE, seven USB 2.0
  • Supports Smart Embedded Management Agent (SEMA®) functions
  • ETX Module with Intel Atom® Processor E3800 Series SoC (formerly codename: Bay Trail)
  • Intel Atom® E3800 Series SoC and Celeron® N2930/J1900 Processor
  • Up to 8 GB non-ECC DDR3L at 1333 MHz
  • Dual channel 24-bit LVDS and VGA
  • 2x SATA or 2x PATA (Master only), 4x USB 2.0, 10/100 Mbps LAN (GbE via onboard connector)
  • Extreme Rugged operating temperature: -40° to +85° (opt.)
  • Supports Smart Embedded Management Agent (SEMA) functions
  • COM Express® mini Type 10 with Intel Atom® X7000E / X7000RE series
  • Low-Power – Performance/Watt optimized form factor solution
  • Up to 16 GByte LPDDR5 memory down (In-Band ECC)
  • 2x USB 3.2 Gen2/2.0, 6x USB 2.0
  • 1 GbE (optional 2.5 GbE) with TSN support
  • Industrial grade temperature
  • COM Express® mini Type 10 with 13th generation Intel® Core™/Pentium® processors
  • Up to 32 GByte LPDDR5(x) memory down
  • Up to 2.5 Gb Ethernet with TSN support
  • Optional NVMe SSD onboard
  • Industrial grade versions
Kontron-COMe-mEL10
  • COM Express® mini Type 10 with Intel Atom® x6000E, Pentium® and Celeron® Series
  • Low-Power – Performance/Watt optimized form factor solution
  • Up to 16 GByte LPDDR4 memory down (In-Band ECC)
  • 2x USB 3.1/2.0, 6x USB 2.0, USB client optional, 2x SATA, eMMC Flash
  • TSN support
  • Industrial grade temperature
kontron come-mal10
  • COM Express® mini Type 10 with Intel® Atom® E3900, Pentium® and Celeron® Processor Series
  • Low-Power – Performance / Watt optimized small form factor solution
  • Up to 8 GByte DDR3L memory down (ECC / non ECC)
  • 2x USB 3.0/2.0, 6x USB 2.0, 2x SATA, eMMC Flash
  • Industrial grade temperature
  • Support of Kontron’s Embedded Security Solution – APPROTECT (optional)
kontron COMe-m4AL10
  • COM Express® mini Type 10 with Intel® Atom® E3900, Pentium® and Celeron® Processor Series
  • Low-Power – Performance / Watt optimized small form factor solution
  • Up to 16 GByte DDR3L memory down (non ECC)
  • 2x USB 3.0/2.0, 6x USB 2.0, 2x SATA, eMMC Flash
  • Industrial grade temperature
  • Support of Kontron’s Embedded Security Solution – APPROTECT (optional)
Kontron come-mbt10
  • COM Express® mini Type 10 with Intel® Atom™ E3800 & Celeron® Series
  • Up to 4GB DDR3L memory down (ECC optional)
  • 1x USB 3.0, up to 7x USB 2.0, 1x USB client (optional), eMMC Flash, 2x SATA, SD-Card
  • Commercial & Industrial Grade Temperature
advantech som-5883 computer on module basic
  • Intel® 11th Gen Core Processors, up to 8Core/16T, L3 Cache 24M
  • Intel Iris Xe(Gen 12) graphics, 4 independent 4K display
  • Dual channel DDR4 Max 128GB SODIMM, support ECC
  • Super speed I/O: PCIe4 x16 (16GT/s), USB3.2 gen3 (10Gb), 2.5GbE(w/TSN), SATA3 (6Gb)
  • TPM2.0 security protection, onboard NVMe SSD fast & anti-vibration
  • Supports iManager, Edge-AI Suite, DeviceOn
COM - Advantech-SOM-5992
  • Intel® Xeon® Processor D-1500 Product Family COM Express® SOM-5992 Basic Module Type 7
  • Up to 16 cores with 45W thermal design power
  • Dual DDR4 ECC 2400, 1.2V Low Power Memory, Max. 64GB
  • 1 PCIe x16, 1 PCIe x8, 8 PCIe x1, 2 x 10GBASE-KR interface
Advantech SOM-9590
  • COM Express R3.0 Basic Module Type 7 pin out
  • Intel® Xeon® Processor D-1500 Product Family
  • Solder-down Memory and SSD w/ ECC
  • High speed Ethernet (dual 10GBASE-KR interfaces, one GbE)
  • Abundant expansion. (PCIe x16, PCIe x8, 8 PCIe x1)
  • Supports iManager, WISE-PaaS/DeviceOn and embedded software APIs
COM - Advantech-SOM-5899
  • 9th/8th Gen Intel Xeon/Core Processors COM Express Basic Module Type 6
  • 3* DDI (digital display interface) 4k resolution
  • 4* USB3.1 Gen 2 (10Gbps) / PEG x16 & 8* PCIe Gen3 (8Gbps)
  • 6C CPU with 96GB large memory capacity
COM - Advantech-SOM-5898
  • 7th Gen Intel Core/Celeron Processors COM Express Basic Module Type 6
  • Dual channel DDR4 2400, Max 32GB (ECC optional)
  • Support Three independent symmetrical displays (up to 4K)
  • Flexible I/O support: Gen3 PEG and PCIe, USB3.0 and SATA3
advantech som-5871
  • AMD Ryzen Embedded V1000 COM Express Basic Module Type 6
  • Dual channel DDR4, Max 32GB (Both ECC & Non-ECC)
  • Supports Quad independent symmetrical displays (4 4K Displays)
  • Rich IO Interfaces-2 SATA, 2 USB 3.1 Gen2, 1 USB 3.1 Gen1, 8 USB 2.0, 2 COM, TPM
  • Supports iManager, WISE-PaaS/RMM and Embedded Software APIs
Advantech SOM-6883 COMe Compact
  • 11th Generation Intel® Core™ Processor U-Series
  • COM Express R3.0 Compact Module Type 6 Pinout
  • Dual channel with one memory down and one SODIMM
  • High speed I/O: 1 PCIe x4 Gen4, 5 PCIe x1 Gen3, 4 USB3.2 Gen2
  • Onboard NVMe x4 SSD up to 64GB, TPM2.0
  • Supports iManager, Embedded Software APIs and WISE-DeviceOn
  • COM Express® R3.0 Compact Module Type 6 Pinout
  • Intel® Pentium®/Celeron® and Atom® x6000 Series (Elkhart Lake) Processors
  • Dual Channel up to 32GB DDR4-3200 and IBECC Supported by Specific SKUs
  • Supports up to 3 simultaneous display: LVDS/eDP, HDMI/DisplayPort
  • Supports onboard eMMC Storage and 2.5GbE
  • Supports iManager, WISE-DeviceOn, and Embedded Software APIs
COM - Advantech-SOM-6869
  • Intel® Pentium® N4200, Celeron® N3350, and Atom® E3900 Series COM Express Compact Module Type 6
  • 8GB, dual Channel 1866 DDR3L memory (A1: non-ECC ; B1: ECC)
  • Supports up to 3 simultaneous display: LVDS/eDP, VGA, HDMI/DisplayPort
  • Supports H.264/AVC, H.265/HEVC, VP9, VP8 HW DECODE
  • Supports Wide-range opreating temp./wide range power input 4.75 ~ 20 V
advantech COMe compact SOM-6872
  • AMD Embedded Ryzen 7nm SoC – V2000 APU
  • COM Express® R3.0 Compact Module Type 6 Pinout
  • Dual Channel DDR4 SODIMM, max. 64GB (Both ECC & Non-ECC)
  • High Speed I/Os: 2 USB 3.2 Gen2, 1 PCIe x8 Gen3, 8 PCIe x1 Gen3, and 2 SATA3.0
  • Four Display (DP++, HDMI, VGA, LVDS)
  • Supports iManager, Embedded Software APIs and WISE-DeviceOn
Advantech SOM-7583 COMe mini
  • COMe Mini Type-10
  • Intel® Tiger Lake UP3 processors
  • 16GB LPDDR4X 4266MT/s and IBECC support
  • USB4 Compliance supported by carrier board design
  • NVMe SSD onboard
  • Operating temperatures: Standard 0 ~ 60 °C (32 ~140 °F) or Extended -40 ~ 85 °C (-40 ~ 185 °F)
advantech SOM-7567
  • COM R.2.1 Type 10 Mini Module
  • Intel® Atom™/Celeron® processor for Intelligent systems
  • Onboard DDR3L and SSD
  • 4.75 ~ 20 V wide-voltage input support
  • Embedded Software APIs and Utilities supported
Advantech SOM-7569
  • COM R.2.1 Type 10 Mini Module
  • Intel® Atom™ E3900 & Pentium® / Celeron® Processor
  • Max 8GB DDR3L onboard memory (support ECC, E3900 SKU only)
  • Dual Display: LVDS, HDMI/DisplayPort
  • onboard eMMC(default 32GB), TPM2.0
  • Supports H.264/AVC, H.265/HEVC, VP9, VP8 HW DECODE
  • Supports Wide-range operating temp./Wide range power input 4.75 ~ 20 V
  • iManager and Embedded Software APIs
  • Intel® Core™ i3, N series and Atom® x7000 Series Processors (Alder Lake-N/Amston Lake) COM Express® Mini Type 10 Module
  • COM Express® R3.1 Mini Module Type 10 Pinout
  • Intel® Core™ i3, N series and Atom® x7000 Series Processors
  • Single-CH LPDDR5 4800MT/s up to 16GB, support IBECC
  • 2.5GbE support TSN
  • Multiple I/O expansion: PCIe gen3, USB3.2 Gen2, SATA3.0
  • On board eMMC (Optional)
  • Supports iManager, Embedded Software APIs and Wise-DeviceOn
  • COM Express Mini Size Type 10 Module with Intel Atom® x6000 Processors
  • LPDDR4 with in-band ECC error correction
  • TCC and 2.5GbE with optional TSN
  • PCIe Gen3 lanes, USB 3.2 10Gbps
  • Real-time I/O (GPIO, UART, I2C)

Consulting & Support

Do you have any further questions about Computer-On-Modules? We will be happy to answer any questions you may have. As Germany’s leading system integrator, we provide our customers with individual support in the area of Computer-On-Modules and quickly find customized solutions.

Together with our technology partners we find the best embedded solutions in the area of Computer-On-Modules. Contact us directly now!